Flexible e-skin combines liquid metal circuits with fibrous substrates
Researchers at the Hong Kong Polytechnic University and other institutes in China have developed an intrinsically permeable, three-dimensional integrated and flexible electronic skin. The e-skin is based on high-density inorganic electronic components placed on organic stretchable fibrous substrates.
For the full story, see the September 2024 edition of Smart Textiles & Wearables.
Image: Zhuang et al