Permeable 3D electronic skin in liquid metal circuits and fibrous substrates
A research team led by the Department of Applied Biology and Chemical Technology, Hong Kong Polytechnic University, has developed an innovative approach that utilises liquid metal circuits and organic stretchable fibrous substrates to achieve a permeable, 3D integrated electronic skin.
For the full story, see the April 2025 edition of Smart Textiles & Wearables.
Image: Hong Kong Polytechnic University