Bicomponent 3D spunbond nonwoven

CETI-high-loft

The three-dimensional nonwovens market is dominated by needlepunched and air-through bonded carding processes using staple fibres.

However, a bicomponent 3D spunbond nonwoven material that offers low density and resilience has now been developed by the Centre Européen des Textiles Innovants (European Center for Innovative Textiles – CETI).

Potential applications of this material for the automotive market include acoustic and thermal management.

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