Chainmail-like material could be the future of armour
A research team led by Northwestern University of Evanston, Illinois, USA, has developed what is claimed to be the first two-dimensional mechanically interlocked material.
Resembling the interlocking links in chainmail, the nanoscale material is said to exhibit exceptional flexibility and strength. With further work, it holds promise for use in high-performance, lightweight body armour and other uses that demand lightweight, flexible and tough materials.
For the full story, see the February 2025 edition of Smart Textiles & Wearables.
Image: Mark Seniw, Center for Regenerative Nanomedicine, Northwestern University