Water vapour plasma for wearable electronics
A method for improving the flexibility of ultra-thin electronics, such as those used in bendable devices or clothing, has been developed by researchers at the Riken Center for Emergent Matter Science and the Riken Cluster for Pioneering Research in Japan.
The technique involves the use of water vapour plasma to directly bond gold electrodes fixed onto separate ultra-thin polymer films – without the need for adhesives or high temperatures.
For the full story, see the February 2022 edition of Smart Textiles & Wearables.
Photos: Riken CEMS/CPR